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Ultrathin diamond blades for dicing single crystal SiC developed using a novel bonding method

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Indexed by : Journal paper

Authors :HSQ

Date of Publication : 2022-12-01

Affiliation of Author(s) : 301

Funded by : 国家自然科学基金项目

ISSN : 1526-6125

Translation or Not : no

Next One : 脆性材料磨粒加工的纳米尺度去除机理

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Associate Professor
Supervisor of Master's Candidates

Degree : 博士学位

Alma Mater : 浙江工业大学

Education Level : 博士研究生毕业

School/Department : 机械工程学院

Date of Employment : 2021-12-16

Discipline : Mechanical Manufacture and Mutomation

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